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For the Inventor, By the Inventor

Saratoga, CA, United States of America

Hunt Hang Jiang

This inventor holds 30 USPTO granted patents and 13 published patent applications, primarily in Integrated Circuit Packaging. Top assignees: Monolithic Power Systems, Inc., Fujitsu Corporation, Chengdu Monolithic Power Systems Co., Ltd.. Active years: 2000-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hunt Hang Jiang. Retrieved from https://idiyas.com/inventor/hunt-hang-jiang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 30 

% Patents Active = 86.7

Average Co-Inventor Count = 1.9

ph-index = 9

Forward Citations = 325(Granted Patents)


Location History:

  • San Jose, CA (US) (2000 - 2014)
  • Saratoga, CA (US) (2012 - 2024)

Company Filing History:

goldMedal15 out of 388 
 
Monolithic Power Systems, Inc.
 patents
silverMedal9 out of 39,381 
 
Fujitsu Corporation
 patents
bronzeMedal6 out of 327 
 
Chengdu Monolithic Power Systems Co., Ltd.
 patents

Years Active: 2000-2026

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Areas of Expertise:
Double-Side-Cooling
Flip Chip Package
Thermal Protection Film
Multi-Die Package
Integrated Circuit Structure
3-D Package
Copper Structures
Microelectronic Packages
Power Converter
Heat Dissipation
Conductive Composition
Multilayer Circuit
30 patents (USPTO):Explore Patents
1. 12751337 - Double-side-cooling power module (2026-09-29),
2. 12266583 - Flip chip package unit and associated packaging method (2025-04-01),
3. 12159792 - Flip chip package unit comprising thermal protection film and associated packaging method (2024-12-03),
4. 12002787 - Multi-die package structure and multi-die co-packing method (2024-06-04),
5. 11824001 - Integrated circuit package structure and integrated circuit package unit (2023-11-21),
6. 11670600 - Panel level metal wall grids array for integrated circuit packaging (2023-06-06),
7. 11652029 - 3-D package structure for isolated power module and the method thereof (2023-05-16),
8. 11616017 - Integrated circuit package structure, integrated circuit package unit and associated packaging method (2023-03-28),
9. 10461052 - Copper structures with intermetallic coating for integrated circuit chips (2019-10-29),
10. 10083930 - Semiconductor device reducing parasitic loop inductance of system (2018-09-25),
11. 9754909 - Copper structures with intermetallic coating for integrated circuit chips (2017-09-05),
12. 9070671 - Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing (2015-06-30),
13. 8906797 - Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing (2014-12-09),
14. 8810013 - Integrated power converter package with die stacking (2014-08-19),
15. 8604597 - Multi-die packages incorporating flip chip dies and associated packaging methods (2013-12-10),

Title: The Innovative Journey of Hunt Hang Jiang

Introduction: Hunt Hang Jiang, a visionary inventor based in Saratoga, CA, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Hunt Hang Jiang's latest patents include cutting-edge technologies in artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: With a career spanning over two decades, Hunt Hang Jiang has established himself as a leading figure in the tech industry, holding numerous patents that have revolutionized various sectors. His keen eye for identifying gaps in the market and developing solutions has led to the successful commercialization of several inventions.

Collaborations: Throughout his career, Hunt Hang Jiang has collaborated with top research institutions, leading companies, and brilliant minds in the industry to bring his ideas to life. His ability to work effectively in multidisciplinary teams has resulted in the creation of groundbreaking technologies that have had a lasting impact.

Conclusion: Hunt Hang Jiang's relentless pursuit of innovation and his passion for creating technologies that shape the future make him a true pioneer in the world of inventions. His work continues to inspire the next generation of inventors and solidify his legacy as a trailblazer in the field of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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