The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2024
Filed:
Dec. 08, 2021
Applicant:
Chengdu Monolithic Power Systems Co., Ltd., Chengdu, CN;
Inventors:
Yingjiang Pu, Chengdu, CN;
Hunt Jiang, Saratoga, CA (US);
Assignee:
Chengdu Monolithic Power Systems Co., Ltd., Sichuan, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/56 (2013.01); H01L 23/5383 (2013.01); H01L 23/5389 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 25/50 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48227 (2013.01);
Abstract
A multi-die package structure with an embedded die embedded in a substrate, a flip chip die mounted above the substrate, and an attached die attached onto the flip chip die. The package is compact and low cost.