Chengdu, China

Yingjiang Pu

USPTO Granted Patents = 6 

Average Co-Inventor Count = 2.8

ph-index = 1


Company Filing History:


Years Active: 2023-2025

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6 patents (USPTO):Explore Patents

Title: Innovations of Yingjiang Pu in Flip Chip Packaging Technology

Introduction

Yingjiang Pu is a notable inventor based in Chengdu, China, recognized for his contributions to the field of integrated circuit packaging. With a total of six patents to his name, he has made significant advancements in flip chip packaging technology, which is crucial for modern electronics.

Latest Patents

Yingjiang Pu's latest patents include innovative designs for flip chip package units and associated packaging methods. One of his patents describes a flip chip package unit that features an integrated circuit (IC) die with multiple metal pillars on its first surface. This design allows the IC die to be attached to a rewiring substrate, with an under-fill material filling the gaps between them. The back protective film attached to the second surface of the IC die is designed to be UV sensitive, transitioning from non-solid to solid after UV irradiation while maintaining its viscosity. This film provides physical protection and an effective heat dissipation path for the IC die.

Another patent focuses on a flip chip package unit that includes a thermal conductive protection film. This film covers the entire second surface of the IC die and part of its sidewalls. It is engineered to have excellent thermal conductivity and is resistant to falling off, ensuring physical protection and electromagnetic interference protection while facilitating effective heat dissipation.

Career Highlights

Yingjiang Pu is currently employed at Chengdu Monolithic Power Systems Co., Ltd., where he continues to innovate in the field of semiconductor packaging. His work has been instrumental in enhancing the reliability and performance of electronic devices.

Collaborations

Yingjiang Pu collaborates with talented coworkers such as Hunt Hang Jiang and Xiuhong Guo, contributing to a dynamic team focused on advancing technology in their field.

Conclusion

Yingjiang Pu's innovative work in flip chip packaging technology has made a significant impact on the electronics industry. His patents reflect a commitment to improving the efficiency and reliability of integrated circuits, showcasing his expertise and dedication to innovation.

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