The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Sep. 08, 2021
Chengdu Monolithic Power Systems Co., Ltd., Chengdu, CN;
Chengdu Monolithic Power Systems Co., Ltd., Chengdu, CN;
Abstract
An IC package structure including an array of package units formed into a panel-shaped package units array. Each package unit has a continuous and closed metal wall surrounding the periphery of the package unit and at least one IC chip/IC die disposed in the package unit, and wherein each IC chip/IC die has a top surface and a back surface opposite to the top surface. A panel-shaped metal layer corresponding to the panel-shaped package units array can be formed on entire back side of the IC package structure and bonded to the metal wall of each package unit, wherein the back side of the IC package structure refers to the side to which the back surface of each IC chip/IC die is facing.