Xiuhong Guo

Title: Innovations by Xiuhong Guo in Flip Chip Packaging

Introduction

Xiuhong Guo is a notable inventor based in Chengdu, China, recognized for his contributions to the field of integrated circuit packaging. With a total of six patents to his name, Guo has made significant advancements in flip chip packaging technology, which is crucial for modern electronics.

Latest Patents

Guo's latest patents include innovative designs for flip chip package units and associated packaging methods. One of his patents describes a flip chip package unit that features an integrated circuit (IC) die with multiple metal pillars on its first surface. This design allows the IC die to be attached to a rewiring substrate, with an under-fill material filling the gaps between them. The back protective film used in this design is notable for its UV sensitivity, which allows it to transition from non-solid to solid after UV irradiation while maintaining its viscosity. This film provides physical protection and an effective heat dissipation path for the IC die.

Another patent focuses on a flip chip package unit that incorporates a thermal conductive protection film. This film covers the entire second surface of the IC die and part of its sidewalls. It is designed to offer excellent thermal conductivity and protection against electromagnetic interference, ensuring the IC die remains secure and functional under various conditions.

Career Highlights

Xiuhong Guo is currently employed at Chengdu Monolithic Power Systems Co., Ltd., where he continues to innovate in the field of semiconductor packaging. His work has been instrumental in enhancing the performance and reliability of electronic devices.

Collaborations

Guo collaborates with talented colleagues, including Yingjiang Pu and Hunt Hang Jiang, who contribute to the dynamic research environment at his company.

Conclusion

Xiuhong Guo's innovative patents in flip chip packaging demonstrate his commitment to advancing technology in the electronics industry. His work not only enhances the functionality of integrated circuits but also sets new standards for packaging methods.