Taichung, Taiwan

Hung-Yu Wei

This inventor holds 10 USPTO granted patents. Top assignees: Winbond Electronics Corporation, Windbond Electronics Corp.. Active years: 2021-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hung-Yu Wei. Retrieved from https://idiyas.com/inventor/hung-yu-wei-l75odvwf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.4

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021-2025

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10 patents (USPTO):Explore Patents

Title: The Innovations of Hung-Yu Wei

Introduction

Hung-Yu Wei is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work focuses on enhancing the efficiency and structure of dynamic random access memory (DRAM).

Latest Patents

Among his latest patents is a dynamic random access memory structure and a method for forming the same. This semiconductor structure includes a substrate, an isolation feature, a word line, and a doped region. The substrate has an active region, while the isolation feature is disposed in the substrate to define this active region. The word line is buried in the substrate and extends across both the active region and the isolation feature. It consists of a first conductive structure and a second conductive structure placed on the first conductive structure. The doped region is located in the active region and adjacent to the word line, ensuring that the top surface of the first conductive structure is below the bottom surface of the doped region. Another notable patent involves a semiconductor structure that includes multiple pairs of target patterns, a first conductive line, and a second conductive line. Each pair of target patterns consists of a top pattern and a bottom pattern, with the first conductive line connected to the top pattern and the second conductive line connected to the bottom pattern.

Career Highlights

Hung-Yu Wei is currently employed at Winbond Electronics Corporation, where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing memory technology, which is crucial for modern computing applications.

Collaborations

He collaborates with talented coworkers, including Pei-Hsiu Peng and Kai Jen, who contribute to the innovative environment at Winbond Electronics Corporation.

Conclusion

Hung-Yu Wei's contributions to semiconductor technology through his patents and work at Winbond Electronics Corporation highlight his role as a key innovator in the field. His advancements in dynamic random access memory structures are paving the way for future developments in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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