The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Jul. 03, 2022
Applicant:

Winbond Electronics Corp., Taichung, TW;

Inventors:

Pei-Hsiu Peng, Taichung, TW;

Hung-Yu Wei, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2005.12); H01L 21/66 (2005.12);
U.S. Cl.
CPC ...
H01L 21/0338 (2012.12); H01L 21/0335 (2012.12); H01L 21/0337 (2012.12); H01L 22/12 (2012.12);
Abstract

Provided is a semiconductor structure including multiple pairs of target patterns, a first conductive line, and a second conductive line. Each of the pairs of target patterns includes a top pattern and a bottom pattern. The first conductive line is disposed on a first side of the pairs of target patterns. The first conductive line is electrically connected to a top pattern of a (aN+1)pair of target patterns in the pairs of target patterns, a is a fixed integer greater than or equal to 2, and N is an integer greater than or equal to 0. The second conductive line is disposed on a second side of the pairs of target patterns opposite to the first side. The second conductive line is electrically connected to a bottom pattern of the (aN+1)pair of target patterns in the pairs of target patterns.


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