The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2023
Filed:
May. 14, 2021
Applicant:
Winbond Electronics Corp., Taichung, TW;
Inventor:
Hung-Yu Wei, Taichung, TW;
Assignee:
WINBOND ELECTRONICS CORP., Taichung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 12/00 (2006.01); H10B 12/00 (2023.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H10B 12/30 (2023.02); H01L 29/0653 (2013.01); H10B 12/02 (2023.02);
Abstract
A semiconductor structure includes a semiconductor substrate including a first active region and a chop region. The semiconductor structure also includes a source/drain region disposed in the first active region, an isolation structure disposed in the chop region, and a gate structure extending at least across the isolation structure in the chop region. The gate structure includes a gate electrode layer and a gate lining layer lining on the gate electrode layer. The gate lining layer includes a first portion having an upper surface that is lower than a bottom surface of the source/drain region.