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Taichung, Taiwan

Windbond Electronics Corp.

USPTO Granted Patents = 106

% Expired Patents = 11.3

Forward Citations = 517

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147 inventors (with patents filed for the assignee):

Takahiko Sato (5 out of 32 patents)

Wen-Yueh Jang (3 out of 39 patents)

Hitoshi Ikeda (3 out of 98 patents)

4. Koying Huang (3 out of 23 patents)

5. Hiroki Murakami (3 out of 44 patents)

6. Masaru Yano (3 out of 80 patents)

7. Shinya Fujioka (3 out of 99 patents)

8. Ta-Lee Yu (3 out of 78 patents)

9. Shyh-Chyi Wong (3 out of 49 patents)

10. Makoto Senoo (2 out of 26 patents)

11. An-Tung Chen (2 out of 40 patents)

12. Douk Hyoun Ryu (2 out of 2 patents)

13. Kaoru Mori (2 out of 55 patents)

14. Yung-Peng Hwang (2 out of 9 patents)

15. Ming-Bing Chang (2 out of 20 patents)

Core Competencies:

Semiconductor Device

Memory Device

Flash Memory

RRAM

Dynamic Random Access Memory

Voltage Generation

Testing Circuit

Delay Control Circuit

Non-Volatile Memory

Probe Tip Landing

Electrostatic Discharge Protection

106 patents: Sort by Forward Citations

1. 12633352 - Memory device capable of operating multiple planes simultaneously (2026-05-19),

2. 12495548 - Semiconductor device and forming method thereof (2025-12-09),

3. 12474371 - Measurement system and probe tip landing method (2025-11-18),

4. 12469528 - Memory device and wrap around read method thereof (2025-11-11),

5. 12456639 - Pick-up structure for memory device and manufacturing method thereof (2025-10-28),

6. 12385968 - Stress testing circuit and semiconductor memory device (2025-08-12),

7. 12380955 - Memory controller and method for adaptively programming flash memory (2025-08-05),

8. 12380949 - Semiconductor memory device (2025-08-05),

9. 12380933 - Pseudo-static random access memory (2025-08-05),

10. 12348232 - Delay control circuit, semiconductor memory device, and delay control method (2025-07-01),

11. 12314072 - Voltage generating device (2025-05-27),

12. 12310000 - Manufacturing method of semiconductor device (2025-05-20),

13. 12289113 - Delay locked loop (2025-04-29),

14. 12288593 - Semiconductor memory device and method of reading a semiconductor memory device (2025-04-29),

15. 12277964 - Memory device and sense amplifier capable of performing in-memory logical not operation and computing (2025-04-14),

Windbond Electronics Corp. is a leading semiconductor company based in Taichung, Taiwan, specializing in the development and manufacturing of advanced memory solutions. The company focuses on various memory technologies, including Flash Memory, Dynamic Random Access Memory (DRAM), and Resistive Random Access Memory (RRAM). Windbond is dedicated to innovation in semiconductor devices, voltage generation, and testing circuits, positioning itself as a key player in the global semiconductor memory market.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

106 Patents

#22 in Taichung

#222 in Taiwan

#7,388 in the World

Taichung, Taiwan

Windbond Electronics Corp.

Forward Citations = 517

147 inventors:

Takahiko Sato (5 out of 32 patents)

Wen-Yueh Jang (3 out of 39 patents)

Hitoshi Ikeda (3 out of 98 patents)

4. Koying Huang (3 out of 23 patents)

5. Hiroki Murakami (3 out of 44 patents)

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