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Hsinchu, Taiwan

Windbond Electronics Corp.

USPTO Granted Patents = 105

Forward Citations = 507

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147 inventors (with patents filed for the assignee):

Takahiko Sato (5 out of 31 patents)

Wen-Yueh Jang (3 out of 39 patents)

Hitoshi Ikeda (3 out of 97 patents)

4. Koying Huang (3 out of 22 patents)

5. Hiroki Murakami (3 out of 44 patents)

6. Shinya Fujioka (3 out of 99 patents)

7. Ta-Lee Yu (3 out of 78 patents)

8. Makoto Senoo (2 out of 26 patents)

9. Masaru Yano (2 out of 77 patents)

10. An-Tung Chen (2 out of 40 patents)

11. Douk Hyoun Ryu (2 out of 2 patents)

12. Kaoru Mori (2 out of 55 patents)

13. Shyh-Chyi Wong (2 out of 49 patents)

14. Yung-Peng Hwang (2 out of 9 patents)

15. Ming-Bing Chang (2 out of 20 patents)

Core Competencies:

Memory Device

Semiconductor Memory

Flash Memory

Dynamic Random Access Memory

Resistive Random Access Memory

Voltage Generation Circuit

Delay Control Circuit

Power Supply Control Circuit

Testing Circuit

Non-Volatile Memory

Pseudo-Static Random Access Memory

Three-Dimensional Resistive Memories

105 patents: Sort by Forward Citations

1. 12495548 - Semiconductor device and forming method thereof (2025-12-09),

2. 12474371 - Measurement system and probe tip landing method (2025-11-18),

3. 12469528 - Memory device and wrap around read method thereof (2025-11-11),

4. 12456639 - Pick-up structure for memory device and manufacturing method thereof (2025-10-28),

5. 12385968 - Stress testing circuit and semiconductor memory device (2025-08-12),

6. 12380955 - Memory controller and method for adaptively programming flash memory (2025-08-05),

7. 12380949 - Semiconductor memory device (2025-08-05),

8. 12380933 - Pseudo-static random access memory (2025-08-05),

9. 12348232 - Delay control circuit, semiconductor memory device, and delay control method (2025-07-01),

10. 12314072 - Voltage generating device (2025-05-27),

11. 12310000 - Manufacturing method of semiconductor device (2025-05-20),

12. 12289113 - Delay locked loop (2025-04-29),

13. 12288593 - Semiconductor memory device and method of reading a semiconductor memory device (2025-04-29),

14. 12277964 - Memory device and sense amplifier capable of performing in-memory logical not operation and computing (2025-04-14),

15. 12260894 - Voltage generation circuit for memory device with series connected resistors (2025-03-25),

Windbond Electronics Corp. is a leading global supplier of flash memory solutions. With a focus on high-quality products and innovation, Windbond provides a wide range of memory products for various applications including consumer electronics, automotive, industrial, and more. The company is committed to delivering cutting-edge technology and excellent customer service to meet the demands of the digital world.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

105 Patents

#39 in Hsinchu

#218 in Taiwan

#7,248 in the World

Hsinchu, Taiwan

Windbond Electronics Corp.

Forward Citations = 507

147 inventors:

Takahiko Sato (5 out of 31 patents)

Wen-Yueh Jang (3 out of 39 patents)

Hitoshi Ikeda (3 out of 97 patents)

4. Koying Huang (3 out of 22 patents)

5. Hiroki Murakami (3 out of 44 patents)

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