IDiyas

For the Inventor, By the Inventor

Wuhan, China

Houde Zhou

USPTO Granted Patents = 14 

 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:

goldMedal14 out of 1,139 
 
Yangtze Memory Technologies Co., Ltd.
 patents

Years Active: 2021-2025

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14 patents (USPTO):
1. 12489066 - Electromagnetic interference shielding package structures and fabricating methods thereof (2025-12-02),
2. 12334361 - Substrate structure, and fabrication and packaging methods thereof (2025-06-17),
3. 12205940 - Semiconductor package structure and packaging method thereof (2025-01-21),
4. 12166012 - Flip-chip stacking structures and methods for forming the same (2024-12-10),
5. 12131924 - Method for processing semiconductor wafers (2024-10-29),
6. 12125827 - Chip package structure and manufacturing method thereof (2024-10-22),
7. 12121995 - Laser system for dicing semiconductor structure and operation method thereof (2024-10-22),
8. 12106985 - Laser dicing system and method for dicing semiconductor structure including cutting street (2024-10-01),
9. 11721686 - Semiconductor package structure and packaging method thereof (2023-08-08),
10. 11694904 - Substrate structure, and fabrication and packaging methods thereof (2023-07-04),
11. 11688721 - Chip package structure and manufacturing method thereof (2023-06-27),
12. 11476173 - Manufacturing method of integrated circuit packaging structure (2022-10-18),
13. 11469153 - Electronic component comprising substrate with thermal indicator (2022-10-11),
14. 11133290 - Chip package structure with stacked chips and manufacturing method thereof (2021-09-28),

Title: The Innovative Contributions of Houde Zhou

Introduction

Houde Zhou is a prominent inventor based in Wuhan, China. He has made significant contributions to the field of semiconductor packaging, holding a total of 14 patents. His work focuses on advanced methods for fabricating substrate structures and semiconductor package designs.

Latest Patents

Houde Zhou's latest patents include innovative technologies that enhance semiconductor packaging. One of his notable patents is for a substrate structure and fabrication method. This method involves providing a core substrate with conductive pads and a metal layer, forming a conductive structure for external component attachment, and encapsulating the structure with a molding compound. Another significant patent details a semiconductor package structure that includes stacking semiconductor chips on a substrate, connecting them with metal wires, and encapsulating them in a molding compound.

Career Highlights

Houde Zhou is currently employed at Yangtze Memory Technologies Co., Ltd. His work at this company has positioned him as a key player in the semiconductor industry. His innovative approaches have contributed to advancements in packaging technologies, which are crucial for the performance and reliability of electronic devices.

Collaborations

Houde Zhou collaborates with talented coworkers, including Peng Chen and XinRu Zeng. Their combined expertise fosters a creative environment that drives innovation in semiconductor technology.

Conclusion

Houde Zhou's contributions to semiconductor packaging through his patents and work at Yangtze Memory Technologies Co., Ltd. highlight his role as a leading inventor in the field. His innovative methods continue to shape the future of electronic packaging technologies.

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