The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2024
Filed:
May. 09, 2023
Applicant:
Yangtze Memory Technologies Co., Ltd., Wuhan, CN;
Inventors:
Assignee:
YANGTZE MEMORY TECHNOLOGIES CO., LTD, Wuhan, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/5384 (2013.01); H01L 24/05 (2013.01); H01L 25/50 (2013.01);
Abstract
A chip package structure includes multiple chips stacked together, a molding layer encapsulating the multiple chips, a conductive layer is on a side of the molding layer away from the multiple chips, and a vertical conductive element extending from a surface of the molding layer to the bonding pad. Each of the multiple chips includes a bonding pad not covered by the multiple chips. The vertical conductive element connects the conductive layer and the bonding pad. The vertical conductive element includes gold.