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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12125827 B1

PDFFull Text
Date of Patent:
Oct. 22, 2024

Filed:

May. 09, 2023

Chip package structure and manufacturing method thereof

Applicant:

Yangtze Memory Technologies Co., Ltd., Wuhan, CN;

Inventors:

XinRu Zeng, Wuhan, CN;

Peng Chen, Wuhan, CN;

Houde Zhou, Wuhan, CN;

Assignee:

YANGTZE MEMORY TECHNOLOGIES CO., LTD, Wuhan, CN;

Attorney:

Bayes PLLC

Primary Examiner:

Mamadou L Diallo

Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/5384 (2013.01); H01L 24/05 (2013.01); H01L 25/50 (2013.01);
Abstract

A chip package structure includes multiple chips stacked together, a molding layer encapsulating the multiple chips, a conductive layer is on a side of the molding layer away from the multiple chips, and a vertical conductive element extending from a surface of the molding layer to the bonding pad. Each of the multiple chips includes a bonding pad not covered by the multiple chips. The vertical conductive element connects the conductive layer and the bonding pad. The vertical conductive element includes gold.

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Quick Actions:

Zeng, XinRu. (2024). Chip package structure and manufacturing method thereof (U.S. Patent No. 12125827). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12125827

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