Wuhan, China

Peng Chen

This inventor holds 34 USPTO granted patents and 29 published patent applications and 3 EPO patents, primarily in Semiconductor Packaging. Top assignees: Yangtze Memory Technologies Co., Ltd., Huawei Technologies Co., Limited, Yangtze Memory Technologies., Ltd.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Peng Chen. Retrieved from https://idiyas.com/inventor/peng-chen-2a26xgtf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 34 

% Patents Active = 91.2

 

Average Co-Inventor Count = 3.3

ph-index = 2

Forward Citations = 10(Granted Patents)


Location History:

  • Hubei, CN (2020)
  • Wuhan, CN (2014 - 2023)
  • Nanjing, CN (2024)

Company Filing History:


Years Active: 2014-2026

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Areas of Expertise:
Semiconductor Package Structure
Fabrication Methods
Memory System Packaging
Electromagnetic Shielding
Chip Package Structure
Laser Dicing System
Thermal Indicator
Multi-Aperture Control
Channel Sounding
Interference Cancellation
Wafer Taping
Selective Laser Sintering
34 patents (USPTO):Explore Patents

Title: Innovations of Peng Chen in Semiconductor Technology

Introduction

Peng Chen, an inventive mind hailing from Wuhan, China, is recognized for his significant contributions to the field of semiconductor technology. With a remarkable portfolio of 22 patents, Chen has become a notable figure, focusing on advanced semiconductor packaging and innovative structures that enhance performance and efficiency.

Latest Patents

Among his latest inventions, Chen holds patents for a novel semiconductor package structure and its associated packaging method. This invention encompasses a substrate featuring first conductive pads and packaging pads placed opposite to them. The design incorporates multiple semiconductor chips stacked on the substrate, with a molding compound encapsulating these chips. Key elements include first metal wires connecting the semiconductor chips to the packaging pads, alongside a first metal pad positioned opposite the substrate. Additionally, a second metal wire is embedded within the molding compound, connecting the first metal pad to a chip-contact pad on one of the semiconductor chips.

Another significant patent involves flip-chip stacking structures and the methods for their formation. This innovative design features a semiconductor package equipped with a redistribution layer (RDL) that interfaces with input/output (I/O) contacts. The structure includes a staircase interconnect formation on the RDL's second surface, enabling complex interconnections between integrated circuit (IC) chips and the RDL, thereby improving connectivity and performance.

Career Highlights

Peng Chen has made notable impacts in reputable organizations such as Yangtze Memory Technologies Co., Ltd. and Huawei Technologies Co., Limited. His experiences in these companies have not only allowed him to refine his skills in semiconductor technologies but also to lead projects that focus on enhancing the efficiency and functionality of electronic components.

Collaborations

Throughout his career, Chen has collaborated with talented peers, including Houde Zhou and XinRu Zeng. These partnerships have facilitated a dynamic exchange of ideas and expertise, further driving innovation and development in semiconductor solutions.

Conclusion

Peng Chen's dedication to semiconductor innovation is evident in his extensive portfolio of patents and his impactful collaborations within leading technology firms. As he continues to advance in his career, Chen's contributions will likely play a crucial role in shaping the future of semiconductor technologies and their applications in various fields.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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