XinRu Zeng

This inventor holds 10 USPTO granted patents and 10 published patent applications. Top assignees: Yangtze Memory Technologies Co., Ltd., Yangtze Memory Technologies., Ltd.. Active years: 2021-2026.

USPTO Granted Patents = 10 (Patent Applications = 10)

% Patents Active = 80.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 6(Granted Patents)

Company Filing History:

7 out of 1,190

Yangtze Memory Technologies Co., Ltd.

patents

3 out of 286

Yangtze Memory Technologies., Ltd.

patents

Years Active: 2021-2026

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10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12721222 - Semiconductor package structure, fabrication method and memory system (2026-08-25),

2. 12653033 - Chip package structure and manufacturing methods for the same (2026-06-09),

3. 12557300 - Memory system packaging structure, and method for forming the same (2026-02-17),

4. 12334361 - Substrate structure, and fabrication and packaging methods thereof (2025-06-17),

5. 12205940 - Semiconductor package structure and packaging method thereof (2025-01-21),

6. 12125827 - Chip package structure and manufacturing method thereof (2024-10-22),

7. 11721686 - Semiconductor package structure and packaging method thereof (2023-08-08),

8. 11694904 - Substrate structure, and fabrication and packaging methods thereof (2023-07-04),

9. 11688721 - Chip package structure and manufacturing method thereof (2023-06-27),

10. 11133290 - Chip package structure with stacked chips and manufacturing method thereof (2021-09-28),

Title: Innovations of XinRu Zeng in Semiconductor Packaging

Introduction

XinRu Zeng is a prominent inventor based in Wuhan, China. He has made significant contributions to the field of semiconductor packaging, holding a total of 10 patents. His work focuses on innovative methods for fabricating substrate structures and enhancing semiconductor package designs.

Latest Patents

Among his latest patents, Zeng has developed a method for fabricating a substrate structure for packaging. This method involves providing a core substrate with conductive pads and a metal layer, forming a conductive structure for pasting the substrate onto external components, and encapsulating the structure with a molding compound. Another notable patent is for a semiconductor package structure that includes a substrate with conductive pads, semiconductor chips, and a molding compound that encapsulates the chips, ensuring efficient connectivity through metal wires.

Career Highlights

Zeng is currently employed at Yangtze Memory Technologies Co., Ltd., where he continues to innovate in semiconductor technology. His expertise in substrate structures and packaging methods has positioned him as a key player in the industry.

Collaborations

Zeng collaborates with talented coworkers, including Peng Chen and Houde Zhou, who contribute to his projects and enhance the innovative environment at their company.

Conclusion

XinRu Zeng's contributions to semiconductor packaging through his patents and work at Yangtze Memory Technologies Co., Ltd. highlight his role as a leading inventor in the field. His innovative methods are paving the way for advancements in technology and packaging solutions.