Wuhan, China

XinRu Zeng

USPTO Granted Patents = 7 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2021-2025

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7 patents (USPTO):

Title: Innovations of XinRu Zeng in Semiconductor Packaging

Introduction

XinRu Zeng is a prominent inventor based in Wuhan, China. He has made significant contributions to the field of semiconductor packaging, holding a total of 7 patents. His work focuses on innovative methods for fabricating substrate structures and enhancing semiconductor package designs.

Latest Patents

Among his latest patents, Zeng has developed a method for fabricating a substrate structure for packaging. This method involves providing a core substrate with conductive pads and a metal layer, forming a conductive structure for pasting the substrate onto external components, and encapsulating the structure with a molding compound. Another notable patent is for a semiconductor package structure that includes a substrate with conductive pads, semiconductor chips, and a molding compound that encapsulates the chips, ensuring efficient connectivity through metal wires.

Career Highlights

Zeng is currently employed at Yangtze Memory Technologies Co., Ltd., where he continues to innovate in semiconductor technology. His expertise in substrate structures and packaging methods has positioned him as a key player in the industry.

Collaborations

Zeng collaborates with talented coworkers, including Peng Chen and Houde Zhou, who contribute to his projects and enhance the innovative environment at their company.

Conclusion

XinRu Zeng's contributions to semiconductor packaging through his patents and work at Yangtze Memory Technologies Co., Ltd. highlight his role as a leading inventor in the field. His innovative methods are paving the way for advancements in technology and packaging solutions.

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