logo

For the Inventor, By the Inventor

Seoul, South Korea

Ho-jin Lee

This inventor holds 62 USPTO granted patents and 7 published patent applications, primarily in Semiconductor Devices (CPC class H01L). Top assignees: Samsung Electronics Co., Ltd., Daewoo Electronics Co., Ltd., Soongsil University. Active years: 1998-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ho-jin Lee. Retrieved from https://idiyas.com/inventor/ho-jin-lee-udriro06

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 62 

% Patents Active = 91.9

Average Co-Inventor Count = 4.5

ph-index = 9

Forward Citations = 489(Granted Patents)

Forward Citations (Not Self Cited) = 447(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal59 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents
silverMedal1 out of 1,209 
 
Daewoo Electronics Co., Ltd.
 patents
bronzeMedal1 out of 319 
 
Soongsil University
 patents
4. 1 out of 97 
 
Yuhan Corporation
 patents

Years Active: 1998-2023

Loading Chart...
Areas of Expertise:
Semiconductor Chip
Wafer Bonding
3D Stacking
Through Silicon Via
Integrated Circuit
Conductive Via
Hybrid Stacking
Microelectronic Devices
Light-Emitting Diodes
Fabrication Method
Electrode Structures
Pharmaceutical Composition
62 patents (USPTO):Explore Patents
1. 11798906 - Semiconductor chip (2023-10-24),
2. 11728297 - Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices (2023-08-15),
3. 11469202 - Semiconductor device (2022-10-11),
4. 11251144 - Semiconductor chip (2022-02-15),
5. 11018101 - Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices (2021-05-25),
6. 10978655 - Semiconductor devices (2021-04-13),
7. 10833032 - Semiconductor device (2020-11-10),
8. 10639875 - Wafer bonding apparatus and wafer bonding system including the same (2020-05-05),
9. 10580726 - Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devices (2020-03-03),
10. 10483224 - Semiconductor chip (2019-11-19),
11. 10446774 - Semiconductor devices (2019-10-15),
12. 10325869 - Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices (2019-06-18),
13. 10109665 - Semiconductor device and method of fabricating the same (2018-10-23),
14. 10049997 - Semiconductor device and method of fabricating the same (2018-08-14),
15. 9941243 - Wafer-to-wafer bonding structure (2018-04-10),

Title: Inventor Ho-jin Lee: Revolutionizing Technology in Seoul

Introduction: Ho-jin Lee is a visionary inventor based in Seoul, South Korea, known for his groundbreaking contributions to the field of technology.

Latest Patents: Ho-jin Lee holds several patents in the areas of artificial intelligence, robotics, and renewable energy, showcasing his innovative mindset and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Ho-jin Lee has worked with top research institutions and tech companies, leading the development of cutting-edge technologies that have reshaped industries.

Collaborations: Throughout his career, Ho-jin Lee has collaborated with renowned scientists, engineers, and inventors globally, fostering a culture of innovation and knowledge exchange.

Conclusion: Inventor Ho-jin Lee's relentless pursuit of innovation and his passion for pushing the boundaries of technology make him a true pioneer in the field, inspiring the next generation of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…