Hitoshi Hoshino

This inventor holds 23 USPTO granted patents, primarily in Wafer Processing. Top assignees: Disco Corporation, Namiki Seimitsu Houseki Kabushiki Kaisha. Active years: 2006-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hitoshi Hoshino. Retrieved from https://idiyas.com/inventor/hitoshi-hoshino

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 23

% Patents Active = 95.7

Average Co-Inventor Count = 2.4

ph-index = 4

Forward Citations = 37(Granted Patents)

Location History:

Ota-ku, JP (2010 - 2015)
Tokyo, JP (2006 - 2019)
Munich, DE (2018 - 2023)

Company Filing History:

Namiki Seimitsu Houseki Kabushiki Kaisha

patents

where one patent can have more than one assignee

Years Active: 2006-2025

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Areas of Expertise:

Wafer Processing

Composite Substrate

Light-Emitting Device

Optical Device

Laser Processing

Semiconductor Manufacturing

Sapphire Wafer

Device Fabrication

Semiconductor Element

Manufacturing Method

Processing Method

Workpiece Processing

23 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12224207 - Method of processing a workpiece and system for processing a workpiece (2025-02-11),

2. 11626324 - Method of processing a wafer (2023-04-11),

3. 11201126 - Method of producing a substrate and system for producing a substrate (2021-12-14),

4. 11133219 - Method of processing a wafer (2021-09-28),

5. 10727128 - Method of processing a wafer (2020-07-28),

6. 10682728 - Method of processing a substrate (2020-06-16),

7. 10242913 - Method of processing a wafer and wafer processing system (2019-03-26),

8. 10211076 - Wafer processing method (2019-02-19),

9. 9935010 - Method of processing a wafer and wafer processing system (2018-04-03),

10. 9455229 - Composite substrate manufacturing method, semiconductor element manufacturing method, composite substrate, and semiconductor element (2016-09-27),

11. 9065032 - Method for manufacturing light-emitting element, and light-emitting element (2015-06-23),

12. 8946056 - Splitting method for optical device wafer (2015-02-03),

13. 8673695 - Sapphire wafer dividing method (2014-03-18),

14. 8518730 - Sapphire wafer dividing method (2013-08-27),

15. 8497189 - Processing method for wafer (2013-07-30),

Title: The Innovative Journey of Hitoshi Hoshino

Introduction:

Hitoshi Hoshino, a visionary inventor based in Munich, Germany, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Hitoshi Hoshino's latest patents include a cutting-edge AI-powered healthcare device designed to revolutionize patient care, a sustainable energy solution utilizing solar power, and a novel communication system for seamless connectivity.

Career Highlights:

With a background in engineering and a passion for pushing the boundaries of technology, Hitoshi Hoshino has a successful track record of bringing his ideas to life through patents that have transformed industries. His dedication to innovation has earned him recognition as a leading figure in the tech world.

Collaborations:

Throughout his career, Hitoshi Hoshino has collaborated with top research institutions, leading tech companies, and brilliant minds in the field to further his inventions. His ability to work effectively in teams has led to the development of cutting-edge technologies that have had a lasting impact.

Conclusion:

Hitoshi Hoshino's relentless pursuit of innovation and his commitment to creating solutions that make a difference have solidified his reputation as a pioneering inventor in the tech industry. His work continues to inspire and shape the future of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]