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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10727128 B1

PDFFull Text
Date of Patent:
Jul. 28, 2020

Filed:

Feb. 04, 2019

Method of processing a wafer

Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Karl Heinz Priewasser, Munich, DE;

Roland Zimmermann, Munich, DE;

Hitoshi Hoshino, Munich, DE;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer Burns & Crain Ltd.

Primary Examiner:

Elias Ullah

Int. Cl.
CPC ...
H01L 21/78 (2006.01); B23K 26/40 (2014.01); H01L 21/683 (2006.01); H01L 21/304 (2006.01); H01L 21/67 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B23K 26/40 (2013.01); H01L 21/304 (2013.01); H01L 21/67132 (2013.01); H01L 21/6836 (2013.01); B23K 2101/40 (2018.08); H01L 2221/68331 (2013.01);
Abstract

A method of processing a wafer having on one side a device area with a plurality of devices includes providing a protective film and applying the protective film to the device side of the wafer or to the other side of the wafer, so that at least a central area of a front surface of the protective film is in direct contact with the device side or the other side of the wafer. The protective film is attached to the device side or to other side of the wafer, so that at least a part of a peripheral portion of the protective film is attached to at least a part of a lateral edge of the wafer along the entire circumference of the wafer. The lateral edge of the wafer extends from the device side of the wafer to the other side of the wafer.

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