The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2016
Filed:
Apr. 24, 2013
Namiki Seimitsu Houseki Kabushikikaisha, Adachi-ku, Tokyo, JP;
Disco Corporation, Ota-ku, Tokyo, JP;
Hideo Aida, Tokyo, JP;
Natsuko Aota, Tokyo, JP;
Hidetoshi Takeda, Tokyo, JP;
Keiji Honjo, Tokyo, JP;
Hitoshi Hoshino, Tokyo, JP;
Mai Ogasawara, Tokyo, JP;
NAMIKI SEIMITSU HOUSEKI KABUSHIKI KAISHA, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
Provided is a composite substrate manufacturing method, including at least: a first raw board deforming step of preparing a first substrate by deforming a first raw board having at least one surface as a minor surface into a state in which the minor surface warps outward; and a joining step of joining, after the first raw board deforming step, a protruding surface of the first substrate and one surface of a second substrate to each other, thereby manufacturing a composite substrate including the first substrate and the second substrate, in which the second substrate is any one substrate selected from a substrate having both surfaces as substantially flat surfaces and a substrate that warps so that a surface thereof to be joined to the first substrate warps outward. Also provided are a semiconductor element manufacturing method, a composite substrate and a semiconductor element manufactured.