The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2020

Filed:

Jul. 25, 2018
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Karl Heinz Priewasser, Munich, DE;

Hitoshi Hoshino, Munich, DE;

Kenji Furuta, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); B23K 26/53 (2014.01); B23K 26/364 (2014.01); B23K 26/40 (2014.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
B23K 26/364 (2015.10); B23K 26/40 (2013.01); B23K 26/53 (2015.10); H01L 21/3065 (2013.01); H01L 21/78 (2013.01);
Abstract

The invention relates to a method of processing a substrate. The substrate has on a first surface a device area with a plurality of devices partitioned by a plurality of division lines. A pulsed laser beam is applied to the substrate at least in a plurality of positions along each of the division lines, with a focal point located at a distance from the first surface in the direction from the first surface towards a second, opposite surface, so as to form a plurality of modified regions in the substrate along each of the division lines. The second surface of the substrate is then ground to adjust the substrate thickness. After forming modified regions and/or hole regions in the substrate, a plasma can be applied to the substrate so as to form a plurality of grooves extending along the division lines.


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