Kenji Furuta

Title: Innovations by Kenji Furuta in Wafer Technology

Introduction

Kenji Furuta, a prominent inventor based in Tokyo, Japan, has made significant contributions to the field of wafer processing technology. With a remarkable portfolio of 35 patents, he has developed innovative methods and apparatuses that enhance the efficiency and effectiveness of wafer division and processing.

Latest Patents

Kenji Furuta's latest patents demonstrate his ingenuity and technical expertise. One notable invention is the **wafer dividing method and dividing apparatus**, which includes a sophisticated process for forming modified layers as division points. This method integrates the wafer with an annular frame using a dicing tape, enabling a downward division that counts scattered particles to ensure the modified layers' integrity. His **wafer processing method** focuses on a sequence of steps that involve adhesive film bonding, cutting, laser irradiation to form modified layers, and an external force application to achieve precise division.

Career Highlights

Furuta's career includes significant tenures at renowned companies such as Disco Corporation and Olympus Optical Company, Ltd. His work has been pivotal in advancing wafer technology, leading to more efficient manufacturing processes in the semiconductor industry.

Collaborations

Throughout his career, Kenji has collaborated with talented professionals like Ryugo Oba and Yohei Yamashita. These partnerships have enriched his inventions and contributed to groundbreaking advancements in wafer processing technologies.

Conclusion

Kenji Furuta stands out as an influential inventor in the field of wafer technology. His impressive portfolio of patents reflects a commitment to innovation and quality. As the semiconductor industry continues to evolve, Furuta's contributions will play a critical role in shaping its future advancements.