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Kenji Furuta

This inventor holds 35 USPTO granted patents and 7 published patent applications, primarily in Wafer Processing. Top assignees: Disco Corporation, Olympus Optical Company, Ltd.. Active years: 1978-2024.

USPTO Granted Patents = 35 (Patent Applications = 7)

% Patents Active = 100.0

Average Co-Inventor Count = 1.4

ph-index = 6

Forward Citations = 281(Granted Patents)

Location History:

Hachioji, JA (1978)
Hachioji, JP (1982 - 2000)
Ota-ku, JP (2010 - 2014)
Tokyo, JP (1984 - 2024)

Company Filing History:

Olympus Optical Company, Ltd.

patents

Years Active: 1978-2024

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Areas of Expertise:

Wafer Processing

Laser Processing

Electrostatic Chuck

Workpiece Dividing

Height Position Detection

Gallium Arsenide

Modified Layer Formation

Information Transfer

Magnetic Recording

Tape Recorder

Recording Apparatus

Coreless Motor

35 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12074067 - Wafer dividing method and dividing apparatus (2024-08-27),

2. 12062575 - Wafer processing method (2024-08-13),

3. 11548096 - Laser processing apparatus (2023-01-10),

4. 11195757 - Wafer processing method (2021-12-07),

5. 10864598 - Evaluation jig and evaluation method for height position detection unit of laser processing apparatus (2020-12-15),

6. 10682728 - Method of processing a substrate (2020-06-16),

7. 10490450 - Electrostatic chuck table (2019-11-26),

8. 10410901 - Electrostatic chuck table using method (2019-09-10),

9. 9786561 - Wafer processing method (2017-10-10),

10. 9478465 - Wafer processing method (2016-10-25),

11. 9093519 - Wafer processing method (2015-07-28),

12. 9018080 - Wafer processing method (2015-04-28),

13. 8685839 - Workpiece dividing method (2014-04-01),

14. 8592717 - Method of dividing a workpiece having an uneven surface (2013-11-26),

15. 8581144 - Laser processing apparatus and laser processing method (2013-11-12),

Title: Innovations by Kenji Furuta in Wafer Technology

Introduction

Kenji Furuta, a prominent inventor based in Tokyo, Japan, has made significant contributions to the field of wafer processing technology. With a remarkable portfolio of 35 patents, he has developed innovative methods and apparatuses that enhance the efficiency and effectiveness of wafer division and processing.

Latest Patents

Kenji Furuta's latest patents demonstrate his ingenuity and technical expertise. One notable invention is the **wafer dividing method and dividing apparatus**, which includes a sophisticated process for forming modified layers as division points. This method integrates the wafer with an annular frame using a dicing tape, enabling a downward division that counts scattered particles to ensure the modified layers' integrity. His **wafer processing method** focuses on a sequence of steps that involve adhesive film bonding, cutting, laser irradiation to form modified layers, and an external force application to achieve precise division.

Career Highlights

Furuta's career includes significant tenures at renowned companies such as Disco Corporation and Olympus Optical Company, Ltd. His work has been pivotal in advancing wafer technology, leading to more efficient manufacturing processes in the semiconductor industry.

Collaborations

Throughout his career, Kenji has collaborated with talented professionals like Ryugo Oba and Yohei Yamashita. These partnerships have enriched his inventions and contributed to groundbreaking advancements in wafer processing technologies.

Conclusion

Kenji Furuta stands out as an influential inventor in the field of wafer technology. His impressive portfolio of patents reflects a commitment to innovation and quality. As the semiconductor industry continues to evolve, Furuta's contributions will play a critical role in shaping its future advancements.

Profile summary based on public USPTO records.

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