The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Jun. 19, 2019
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Kenji Furuta, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/364 (2014.01); G02B 19/00 (2006.01); G02B 27/28 (2006.01); B23K 26/06 (2014.01); B23K 26/53 (2014.01); B23K 26/066 (2014.01); B23K 101/40 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B23K 26/364 (2015.10); B23K 26/0604 (2013.01); B23K 26/066 (2015.10); B23K 26/0648 (2013.01); B23K 26/0665 (2013.01); B23K 26/53 (2015.10); G02B 19/0047 (2013.01); G02B 27/283 (2013.01); B23K 2101/40 (2018.08); H01L 21/67092 (2013.01);
Abstract

A laser beam applying unit of a laser processing apparatus for processing a wafer includes a laser oscillator for emitting a pulsed laser beam having a wavelength transmittable through the wafer, a beam condenser for converging the pulsed laser beam emitted from the laser oscillator onto the wafer held on a chuck table, a beam splitter assembly disposed between the laser oscillator and the beam condenser, for splitting the pulsed laser beam emitted from the laser oscillator to form at least two converged spots on the wafer that are spaced from each other in X-axis directions, and a mask assembly disposed between the laser oscillator and the beam condenser, for reducing the width of the converged spots on the wafer in Y-axis directions to keep the converged spots on the wafer within the width of the projected dicing lines on the wafer.


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