Hirotaka Shida

This inventor holds 10 USPTO granted patents and 6 published patent applications and 3 EPO patents. Top assignees: Jsr Corporation, Kabushiki Kaisha Toshiba. Active years: 2004-2013.

USPTO Granted Patents = 10 (Patent Applications = 6)

% Patents Active = 40.0

EPO Patents = 3 (Patent Applications = 3)

Average Co-Inventor Count = 4.0

ph-index = 4

Forward Citations = 36(Granted Patents)

Location History:

Chuo-ku, JP (2008 - 2009)
Tokyo, JP (2004 - 2012)
Yokkaichi, JP (2012 - 2013)

Company Filing History:

Kabushiki Kaisha Toshiba

patents

where one patent can have more than one assignee

Years Active: 2004-2013

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10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8574330 - Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method for semiconductor device (2013-11-05),

2. 8506359 - Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method (2013-08-13),

3. 8492276 - Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method (2013-07-23),

4. 8480920 - Chemical mechanical polishing aqueous dispersion, method of preparing the same, chemical mechanical polishing aqueous dispersion preparation kit, and chemical mechanical polishing method (2013-07-09),

5. 8470195 - Chemical mechanical polishing aqueous dispersion preparation set, method of preparing chemical mechanical polishing aqueous dispersion, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method (2013-06-25),

6. 8257504 - Surface treatment composition, surface treatment method, and method for manufacturing semiconductor device (2012-09-04),

7. 8119517 - Chemical mechanical polishing method and method of manufacturing semiconductor device (2012-02-21),

8. 7560384 - Chemical mechanical polishing method (2009-07-14),

9. 7378349 - Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method (2008-05-27),

10. 6726997 - Aqueous dispersion and coated product (2004-04-27),

Title: Hirotaka Shida: Innovator in Chemical Mechanical Polishing

Introduction

Hirotaka Shida is a prominent inventor based in Yokkaichi, Japan. He has made significant contributions to the field of chemical mechanical polishing, particularly in the semiconductor industry. With a total of 10 patents to his name, Shida's work has had a substantial impact on the development of advanced polishing techniques.

Latest Patents

Hirotaka Shida's latest patents include innovative methods and compositions for chemical mechanical polishing. One notable patent describes a chemical mechanical polishing aqueous dispersion that consists of a first water-soluble polymer with a weight average molecular weight of 500,000 to 2,000,000, which includes a heterocyclic ring. This dispersion also contains a second water-soluble polymer or its salt, an oxidizing agent, and abrasive grains, with a pH ranging from 7 to 12. Another patent focuses on an aqueous dispersion for chemical mechanical polishing that includes silica particles and an organic acid, with specific sodium, potassium, and ammonium ion content requirements determined by advanced analytical techniques.

Career Highlights

Throughout his career, Hirotaka Shida has worked with notable companies such as JSR Corporation and Kabushiki Kaisha Toshiba. His experience in these organizations has allowed him to refine his expertise in chemical mechanical polishing and contribute to the advancement of semiconductor manufacturing processes.

Collaborations

Hirotaka Shida has collaborated with esteemed colleagues, including Akihiro Takemura and Masayuki Hattori. These partnerships have fostered innovation and have been instrumental in the development of new technologies in the field.

Conclusion

Hirotaka Shida's contributions to chemical mechanical polishing have established him as a key figure in the semiconductor industry. His innovative patents and collaborations reflect his commitment to advancing technology in this critical area.