The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2013
Filed:
Aug. 07, 2009
Taichi Abe, Yokkaichi, JP;
Hirotaka Shida, Yokkaichi, JP;
Akihiro Takemura, Yokkaichi, JP;
Mitsuru Meno, Suzuka, JP;
Shinichi Hirasawa, Kita-ku, JP;
Kenji Iwade, Hiratsuka, JP;
Takeshi Nishioka, Yokohama, JP;
Taichi Abe, Yokkaichi, JP;
Hirotaka Shida, Yokkaichi, JP;
Akihiro Takemura, Yokkaichi, JP;
Mitsuru Meno, Suzuka, JP;
Shinichi Hirasawa, Kita-ku, JP;
Kenji Iwade, Hiratsuka, JP;
Takeshi Nishioka, Yokohama, JP;
JSR Corporation, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A chemical mechanical polishing aqueous dispersion is used to polish a polishing target that includes an interconnect layer that contains tungsten. The chemical mechanical polishing aqueous dispersion includes: (A) a cationic water-soluble polymer; (B) an iron (III) compound; and (C) colloidal silica particles. The content (M) (mass %) of the cationic water-soluble polymer (A) and the content (M) (mass %) of the iron (III) compound (B) satisfy the relationship 'M/M=0.004 to 0.1'. The chemical mechanical polishing aqueous dispersion has a pH of 1 to 3.