The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2013

Filed:

Mar. 30, 2010
Applicants:

Hirotaka Shida, Yokkaichi, JP;

Akihiro Takemura, Yokkaichi, JP;

Taichi Abe, Yokkaichi, JP;

Inventors:

Hirotaka Shida, Yokkaichi, JP;

Akihiro Takemura, Yokkaichi, JP;

Taichi Abe, Yokkaichi, JP;

Assignee:

JSR Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/3212 (2006.01);
U.S. Cl.
CPC ...
Abstract

A chemical mechanical polishing aqueous dispersion that is used to polish a polishing target that includes a wiring layer that contains tungsten, the chemical mechanical polishing aqueous dispersion including: (A) a cationic water-soluble polymer; (B) an iron (III) compound; and (C) colloidal silica having an average particle diameter calculated from a specific surface area determined by the BET method of 10 to 60 nm, the content (M) (mass %) of the cationic water-soluble polymer (A) and the content (M) (mass %) of the colloidal silica (C) satisfying the relationship 'M/M=0.0001 to 0.003', and the chemical mechanical polishing aqueous dispersion having a pH of 1 to 3.


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