The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2012
Filed:
Jun. 03, 2009
Applicants:
Hirotaka Shida, Yokkaichi, JP;
Yukiteru Matsui, Yokohama, JP;
Atsushi Shigeta, Fujisawa, JP;
Shinichi Hirasawa, Kita-ku, JP;
Hirokazu Kato, Zushi, JP;
Masako Kinoshita, Yokohama, JP;
Takeshi Nishioka, Yokohama, JP;
Hiroyuki Yano, Yokohama, JP;
Inventors:
Hirotaka Shida, Yokkaichi, JP;
Yukiteru Matsui, Yokohama, JP;
Atsushi Shigeta, Fujisawa, JP;
Shinichi Hirasawa, Kita-ku, JP;
Hirokazu Kato, Zushi, JP;
Masako Kinoshita, Yokohama, JP;
Takeshi Nishioka, Yokohama, JP;
Hiroyuki Yano, Yokohama, JP;
Assignees:
JSR Corporation, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 21/461 (2006.01);
U.S. Cl.
CPC ...
Abstract
A chemical mechanical polishing method comprises polishing an organic film using a slurry including polymer particles having a surface functional group and a water-soluble polymer.