The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2008
Filed:
Apr. 11, 2005
Tomohisa Konno, Chuo-ku, JP;
Hirotaka Shida, Chuo-ku, JP;
Kiyonobu Kubota, Chuo-ku, JP;
Masayuki Hattori, Chuo-ku, JP;
Nobuo Kawahashi, Chuo-ku, JP;
Tomohisa Konno, Chuo-ku, JP;
Hirotaka Shida, Chuo-ku, JP;
Kiyonobu Kubota, Chuo-ku, JP;
Masayuki Hattori, Chuo-ku, JP;
Nobuo Kawahashi, Chuo-ku, JP;
JSR Corporation, Tokyo, JP;
Abstract
Disclosed is a chemical mechanical polishing aqueous dispersion comprising (A1) first fumed silica having a specific surface area of not less than 10 m/g and less than 160 m/g and an average secondary particle diameter of not less than 170 nm and not more than 250 nm and (A2) second fumed silica having a specific surface area of not less than 160 m/g and an average secondary particle diameter of not less than 50 nm and less than 170 nm. Also disclosed is a chemical mechanical polishing method using the chemical mechanical polishing aqueous dispersion. According to the chemical mechanical polishing aqueous dispersion and the chemical mechanical polishing method, a chemical mechanical polishing process wherein a barrier metal layer and a cap layer can be efficiently removed by polishing and damage to an insulating film material of a low dielectric constant present in the underlying layer is reduced can be carried out.