Naka-gun, Japan

Hiroshi Tonomura

USPTO Granted Patents = 10 


Average Co-Inventor Count = 4.4

ph-index = 3

Forward Citations = 19(Granted Patents)


Location History:

  • Naka-gun, JP (2012 - 2015)
  • Ibaraki, JP (2015)
  • Naka, JP (2016)

Company Filing History:


Years Active: 2012-2016

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10 patents (USPTO):Explore Patents

Title: Innovations of Hiroshi Tonomura

Introduction

Hiroshi Tonomura is a prominent inventor based in Naka-gun, Japan. He has made significant contributions to the field of power module substrates, holding a total of 10 patents. His work focuses on enhancing the efficiency and performance of power modules through innovative substrate designs.

Latest Patents

Tonomura's latest patents include a variety of advancements in power module substrates. These patents encompass a substrate for power modules, a substrate with a heat sink for power modules, and methods for producing these substrates. One notable patent describes a power module substrate that includes a ceramic substrate and a metal plate made of aluminum or an aluminum alloy. This design incorporates additional elements such as Ag, Zn, Ge, Mg, Ca, Ga, and Li, which are solid-solubilized in the metal plate to improve performance. Another patent details a power module substrate composed of a ceramics substrate made of SiN, joined to a high-purity aluminum metal plate using a brazing filler metal.

Career Highlights

Hiroshi Tonomura has established a successful career at Mitsubishi Materials Corporation, where he has been instrumental in developing advanced materials for power modules. His innovative approaches have led to significant improvements in the efficiency and reliability of power electronics.

Collaborations

Tonomura has collaborated with notable colleagues, including Yoshirou Kuromitsu and Takeshi Kitahara. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and expertise in the field of power module technology.

Conclusion

Hiroshi Tonomura's contributions to the field of power module substrates demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of materials science and engineering, positioning him as a key figure in advancing power electronics technology.

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