The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2015
Filed:
Nov. 13, 2013
Mitsubishi Materials Corporation, Tokyo, JP;
Yoshirou Kuromitsu, Naka-gun, JP;
Kazuhiro Akiyama, Naka-gun, JP;
Takeshi Kitahara, Gotenba, JP;
Hiroshi Tonomura, Naka-gun, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
A power module substrate includes a ceramics substrate composed of SiNhaving a top face. A metal plate composed of aluminum having a purity of 99.99% or more is joined to the top face of the ceramics substrate with a brazing filler metal which includes a melting-point lowering element interposed therebetween. A high concentration section is formed at a joint interface at which the metal plate is joined to the ceramics substrate, has an oxygen concentration greater than an oxygen concentration in the metal plate and in the ceramics substrate, and has a thickness of less than or equal to 4 nm.