The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2014
Filed:
Mar. 11, 2009
Hiromasa Hayashi, Okegawa, JP;
Takeshi Kitahara, Gotenba, JP;
Hiroshi Tonomura, Naka-gun, JP;
Hiroya Ishizuka, Koshigaya, JP;
Yoshirou Kuromitsu, Naka-gun, JP;
Hiromasa Hayashi, Okegawa, JP;
Takeshi Kitahara, Gotenba, JP;
Hiroshi Tonomura, Naka-gun, JP;
Hiroya Ishizuka, Koshigaya, JP;
Yoshirou Kuromitsu, Naka-gun, JP;
Mitsubishi Materials Corporation, Tokyo, JP;
Abstract
A power module substrate having a heatsink, includes: a power module substrate having an insulating substrate having a first face and a second face, a circuit layer formed on the first face, and a metal layer formed on the second face; and a heatsink directly connected to the metal layer, cooling the power module substrate, wherein a ratio B/A is in the range defined by 1.55≦B/A≦20, where a thickness of the circuit layer is represented as A, and a thickness of the metal layer is represented as B.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile