The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2013
Filed:
Jun. 05, 2009
Applicants:
Yoshirou Kuromitsu, Saitama, JP;
Yoshiyuki Nagatomo, Saitama, JP;
Takeshi Kitahara, Gotenba, JP;
Hiroshi Tonomura, Naka-gun, JP;
Kazuhiro Akiyama, Naka-gun, JP;
Inventors:
Yoshirou Kuromitsu, Saitama, JP;
Yoshiyuki Nagatomo, Saitama, JP;
Takeshi Kitahara, Gotenba, JP;
Hiroshi Tonomura, Naka-gun, JP;
Kazuhiro Akiyama, Naka-gun, JP;
Assignee:
Mitsubishi Materials Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/15 (2006.01); H01L 23/06 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
A power module substrate includes: a ceramics substrate having a surface; and a metal plate connected to the surface of the ceramics substrate, composed of aluminum, and including Cu at a joint interface between the ceramics substrate and the metal plate, wherein a Cu concentration at the joint interface is in the range of 0.05 to 5 wt %.