The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2012
Filed:
Jun. 06, 2007
Yoshirou Kuromitsu, Saitama, JP;
Hiroya Ishizuka, Koshigaya, JP;
Hiroshi Miyata, Kitamoto, JP;
Takeshi Kitahara, Toyota, JP;
Hiroshi Tonomura, Naka-gun, JP;
Yoshirou Kuromitsu, Saitama, JP;
Hiroya Ishizuka, Koshigaya, JP;
Hiroshi Miyata, Kitamoto, JP;
Takeshi Kitahara, Toyota, JP;
Hiroshi Tonomura, Naka-gun, JP;
Mitsubishi Materials Corporation, Tokyo, JP;
Abstract
A power element mounting substrate including a circuit layer brazed to a surface of a ceramic plate, and a power element soldered to a front surface of the circuit layer, wherein the circuit layer is constituted using an Al alloy with an average purity of more than or equal to 98.0 wt % and less than or equal to 99.9 wt %, Fe concentration of the circuit layer at a side of a surface to be brazed to the ceramic plate is less than 0.1 wt %, and Fe concentration of the circuit layer at a side of the surface opposite to the surface to be brazed is more than or equal to 0.1 wt %.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile