The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2016
Filed:
Oct. 19, 2010
Yoshiyuki Nagatomo, Saitama, JP;
Kazuhiro Akiyama, Naka-gun, JP;
Nobuyuki Terasaki, Okegawa, JP;
Yoshirou Kuromitsu, Saitama, JP;
Yoshiyuki Nagatomo, Saitama, JP;
Kazuhiro Akiyama, Naka-gun, JP;
Hiroshi Tonomura, Naka, JP;
Nobuyuki Terasaki, Okegawa, JP;
Yoshirou Kuromitsu, Saitama, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
Provided is a power module substrate including a ceramic substrate, and a metal plate which contains aluminum or an aluminum alloy, and which is stacked and bonded on a surface of the ceramic substrate, wherein one or more additional elements selected from Ag, Zn, Ge, Mg, Ca, Ga, and Li are solid-solubilized in the metal plate, and the Ag concentration in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.05% by mass and less than or equal to 10% by mass, or the total concentration of Zn, Ge, Mg, Ca, Ga, and Li in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.01% by mass and less than or equal to 5% by mass.