The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
Nov. 13, 2013
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Yoshirou Kuromitsu, Naka-gun, JP;
Kazuhiro Akiyama, Naka-gun, JP;
Takeshi Kitahara, Gotenba, JP;
Hiroshi Tonomura, Naka-gun, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 1/05 (2006.01); H01L 23/373 (2006.01); H05K 7/06 (2006.01);
U.S. Cl.
CPC ...
H05K 1/053 (2013.01); H01L 23/3735 (2013.01); H05K 1/021 (2013.01); H05K 1/0212 (2013.01); H05K 1/18 (2013.01); H05K 1/181 (2013.01); H05K 7/06 (2013.01); H01L 2224/32225 (2013.01); Y10T 29/49124 (2015.01); Y10T 428/12576 (2015.01);
Abstract
A power module substrate includes a ceramics substrate composed of AlOhaving a top face. A metal plate composed of aluminum having a purity of 99.99% or more is joined to the top face of the ceramics substrate with a brazing filler metal which includes silicon interposed therebetween. A high concentration section is formed at a joint interface at which the metal plate is joined to the ceramics substrate, and has a silicon concentration that is more than five times the silicon concentration in the metal plate.