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For the Inventor, By the Inventor

Hong Kong, China

Hiroshi Ikejima

This inventor holds 24 USPTO granted patents, primarily in Layered Chip Packaging. Top assignees: Headway Technologies, Incorporated, Sae Magnetics (h.k.) Limited, Tdk Corporation. Active years: 2011-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroshi Ikejima. Retrieved from https://idiyas.com/inventor/hiroshi-ikejima

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24

Average Co-Inventor Count = 4.1

ph-index = 5

Forward Citations = 106(Granted Patents)


Company Filing History:

goldMedal24 out of 1,231 
 
Headway Technologies, Incorporated
 patents
silverMedal24 out of 764 
 
Sae Magnetics (h.k.) Limited
 patents
bronzeMedal5 out of 8,267 
 
Tdk Corporation
 patents
where one patent can have more than one assignee

Years Active: 2011-2014

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Areas of Expertise:
Layered Chip Package
Manufacturing Method
Ceramic Capacitor
Composite Package
Heat Sink
Wiring
Layered Design
Thermal Management
Interconnects
Packaging Technology
24 patents (USPTO):Explore Patents
1. 8653639 - Layered chip package and method of manufacturing same (2014-02-18),
2. 8652877 - Method of manufacturing layered chip package (2014-02-18),
3. 8618646 - Layered chip package and method of manufacturing same (2013-12-31),
4. 8541887 - Layered chip package and method of manufacturing same (2013-09-24),
5. 8513034 - Method of manufacturing layered chip package (2013-08-20),
6. 8466562 - Layered chip package (2013-06-18),
7. 8462482 - Ceramic capacitor and method of manufacturing same (2013-06-11),
8. 8441112 - Method of manufacturing layered chip package (2013-05-14),
9. 8432662 - Ceramic capacitor and method of manufacturing same (2013-04-30),
10. 8426979 - Composite layered chip package (2013-04-23),
11. 8421243 - Layered chip package and method of manufacturing same (2013-04-16),
12. 8362602 - Layered chip package and method of manufacturing same (2013-01-29),
13. 8358015 - Layered chip package and method of manufacturing same (2013-01-22),
14. 8344494 - Layered chip package and method of manufacturing same (2013-01-01),
15. 8324741 - Layered chip package with wiring on the side surfaces (2012-12-04),

Title: The Innovative Journey of Hiroshi Ikejima

Introduction: Hiroshi Ikejima is a renowned inventor based in Hong Kong, CN, known for his groundbreaking contributions to various technological fields.

Latest Patents: Hiroshi Ikejima holds several patents in the areas of artificial intelligence, robotics, and renewable energy technologies, showcasing his continuous commitment to innovation.

Career Highlights: With a career spanning over two decades, Hiroshi Ikejima has worked with leading research institutions and tech companies, playing a pivotal role in developing cutting-edge solutions that have revolutionized industries.

Collaborations: Throughout his career, Hiroshi Ikejima has collaborated with top engineers, scientists, and designers from around the world, fostering a culture of creativity and excellence in all his projects.

Conclusion: Hiroshi Ikejima's passion for innovation and his relentless pursuit of technological advancement make him a true pioneer in the world of inventions, inspiring the next generation of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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