Location History:
- Taoyuan, TW (2001 - 2002)
- Taoyuan Hsien, TW (2000 - 2004)
- Hsin-Chu, TW (2002 - 2007)
Company Filing History:
Years Active: 2000-2007
Title: Hermen Liu: Innovator in Wafer Technology
Introduction
Hermen Liu is a prominent inventor based in Taoyuan Hsien, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in wafer processing. With a total of 15 patents to his name, Liu has established himself as a key figure in innovation within the industry.
Latest Patents
Liu's latest patents include a method for pre-processing before cutting a wafer and a method for manufacturing a wafer level chip scale package structure. The pre-processing method involves removing the material layer on the scribe lines close to the corner regions of the dies, which helps preserve the integrity of the corner regions during the cutting process. The wafer level chip scale package structure patent outlines a process that connects a wafer to a glass substrate, followed by drilling and plating to form via plugs, ultimately leading to the creation of chip scale package structures.
Career Highlights
Hermen Liu works at United Microelectronics Corporation, a leading company in the semiconductor industry. His work has been instrumental in advancing wafer technology and improving manufacturing processes. Liu's innovative approaches have garnered attention and respect within the field.
Collaborations
Liu collaborates with talented individuals such as Yimin Huang and Paul Chen, contributing to a dynamic work environment that fosters creativity and innovation.
Conclusion
Hermen Liu's contributions to wafer technology and his impressive portfolio of patents highlight his role as a significant innovator in the semiconductor industry. His work continues to influence advancements in manufacturing processes and technology.