The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2002
Filed:
Mar. 08, 2001
Hermen Liu, Taoyuan, TW;
Yimin Huang, Tai-Chung Hsien, TW;
United Microelectronics Corp., Hsin-Chu, TW;
Abstract
The present invention provides a bonding pad on a semiconductor chip such that peeling of bonding pads during interconnection in the packaging process is avoided. The bonding pad is used to electrically connect an integrated circuit in the semiconductor chip with an external circuit. The semiconductor chip comprises a first dielectric layer positioned in a predetermined area on the surface of the semiconductor chip, a second dielectric layer positioned on the surface of the semiconductor chip outside the predetermined area wherein the first dielectric layer is harder than the second dielectric layer, and a bonding pad positioned on the first dielectric layer for electrically connecting anintegrated circuit (IC) in the semiconductor chip with an external circuit.