The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2007
Filed:
Sep. 27, 2004
Kuo-ming Chen, Beipu Township, Hsinchu County, TW;
Kun-chih Wang, Hsinchu, TW;
Hermen Liu, Hsinchu, TW;
Paul Chen, Hsinchu, TW;
Kai-kuang Ho, Hsinchu, TW;
Kuo-Ming Chen, Beipu Township, Hsinchu County, TW;
Kun-Chih Wang, Hsinchu, TW;
Hermen Liu, Hsinchu, TW;
Paul Chen, Hsinchu, TW;
Kai-Kuang Ho, Hsinchu, TW;
United Microelectronics Corp., Hsinchu, TW;
Abstract
A pre-process before cutting a wafer is described. The wafer includes a plurality of scribe lines and a plurality of dies defined by the scribe lines, and a material layer covers the wafer. A pre-processing step is performed to remove the material layer on the scribe lines close to the corner regions of the dies. Removing the material layer at the corner regions before cutting the wafer is able to preserve the integrity of the corner regions of the cut dies.