Kun-Chih Wang

This inventor holds 22 USPTO granted patents, primarily in Semiconductor Fabrication. Top assignee: United Microelectronics Corp.. Active years: 1999-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kun-Chih Wang. Retrieved from https://idiyas.com/inventor/kun-chih-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22

% Patents Active = 95.5

Average Co-Inventor Count = 2.2

ph-index = 9

Forward Citations = 234(Granted Patents)

Location History:

Tucheng, TW (1999 - 2000)
Taipei Hsien, TW (2000 - 2001)
Taipei, TW (2001)
Tao-Yuan Hsien, TW (2001)
Tao-Yuan, TW (2000 - 2002)
Hsinchu, TW (2004 - 2008)

Company Filing History:

22 out of 7,269

United Microelectronics Corp.

patents

Years Active: 1999-2008

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Areas of Expertise:

Wire Bonding

Wafer Cutting

Chip Scale Package

Dummy Solder Bump

Bonding Pad Structure

Physical Vapor Deposition

Copper Capping Layer

Metal Interconnect

Self-Aligned Via

Multilevel Metal Interconnect

Chemical Plasma Treatment

22 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7372168 - Semiconductor chip capable of implementing wire bonding over active circuits (2008-05-13),

2. 7304385 - Semiconductor chip capable of implementing wire bonding over active circuits (2007-12-04),

3. 7211500 - Pre-process before cutting a wafer and method of cutting a wafer (2007-05-01),

4. 7208837 - Semiconductor chip capable of implementing wire bonding over active circuits (2007-04-24),

5. 7170167 - Method for manufacturing wafer level chip scale package structure (2007-01-30),

6. 7071575 - Semiconductor chip capable of implementing wire bonding over active circuits (2006-07-04),

7. 7026234 - Parasitic capacitance-preventing dummy solder bump structure and method of making the same (2006-04-11),

8. 6900541 - Semiconductor chip capable of implementing wire bonding over active circuits (2005-05-31),

9. 6710448 - Bonding pad structure (2004-03-23),

10. 6707129 - Fuse structure integrated wire bonding on the low k interconnect and method for making the same (2004-03-16),

11. 6371045 - Physical vapor deposition device for forming a metallic layer on a semiconductor wafer (2002-04-16),

12. 6348398 - Method of forming pad openings and fuse openings (2002-02-19),

13. 6339025 - Method of fabricating a copper capping layer (2002-01-15),

14. 6245380 - Method of forming bonding pad (2001-06-12),

15. 6180484 - Chemical plasma treatment for rounding tungsten surface spires (2001-01-30),

Title: Inventor Kun-Chih Wang

Introduction: Kun-Chih Wang is a renowned inventor based in Hsin-Chu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kun-Chih Wang holds several patents in the areas of semiconductor technology, nanotechnology, and renewable energy solutions, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Kun-Chih Wang has worked with leading research institutions and technology companies, playing a pivotal role in developing cutting-edge solutions that have revolutionized various industries.

Collaborations: Throughout his career, Kun-Chih Wang has collaborated with top engineers, scientists, and researchers globally, fostering a culture of innovation and knowledge sharing that has led to the successful implementation of numerous groundbreaking projects.

Conclusion: Kun-Chih Wang's passion for innovation, coupled with his relentless pursuit of excellence, continues to inspire the next generation of inventors and researchers, making him a true pioneer in the world of technology and patents.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]