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For the Inventor, By the Inventor

Hsin-Chu, Taiwan

Kun-Chih Wang

USPTO Granted Patents = 22

Average Co-Inventor Count = 2.2

ph-index = 9

Forward Citations = 233(Granted Patents)


Location History:

  • Tucheng, TW (1999 - 2000)
  • Taipei Hsien, TW (2000 - 2001)
  • Taipei, TW (2001)
  • Tao-Yuan Hsien, TW (2001)
  • Tao-Yuan, TW (2000 - 2002)
  • Hsinchu, TW (2004 - 2008)

Company Filing History:

goldMedal22 out of 7,088 
 
United Microelectronics Corp.
 patents

Years Active: 1999-2008

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22 patents (USPTO):Explore Patents
1. 7372168 - Semiconductor chip capable of implementing wire bonding over active circuits (2008-05-13),
2. 7304385 - Semiconductor chip capable of implementing wire bonding over active circuits (2007-12-04),
3. 7211500 - Pre-process before cutting a wafer and method of cutting a wafer (2007-05-01),
4. 7208837 - Semiconductor chip capable of implementing wire bonding over active circuits (2007-04-24),
5. 7170167 - Method for manufacturing wafer level chip scale package structure (2007-01-30),
6. 7071575 - Semiconductor chip capable of implementing wire bonding over active circuits (2006-07-04),
7. 7026234 - Parasitic capacitance-preventing dummy solder bump structure and method of making the same (2006-04-11),
8. 6900541 - Semiconductor chip capable of implementing wire bonding over active circuits (2005-05-31),
9. 6710448 - Bonding pad structure (2004-03-23),
10. 6707129 - Fuse structure integrated wire bonding on the low k interconnect and method for making the same (2004-03-16),
11. 6371045 - Physical vapor deposition device for forming a metallic layer on a semiconductor wafer (2002-04-16),
12. 6348398 - Method of forming pad openings and fuse openings (2002-02-19),
13. 6339025 - Method of fabricating a copper capping layer (2002-01-15),
14. 6245380 - Method of forming bonding pad (2001-06-12),
15. 6180484 - Chemical plasma treatment for rounding tungsten surface spires (2001-01-30),

Title: Inventor Kun-Chih Wang

Introduction: Kun-Chih Wang is a renowned inventor based in Hsin-Chu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kun-Chih Wang holds several patents in the areas of semiconductor technology, nanotechnology, and renewable energy solutions, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Kun-Chih Wang has worked with leading research institutions and technology companies, playing a pivotal role in developing cutting-edge solutions that have revolutionized various industries.

Collaborations: Throughout his career, Kun-Chih Wang has collaborated with top engineers, scientists, and researchers globally, fostering a culture of innovation and knowledge sharing that has led to the successful implementation of numerous groundbreaking projects.

Conclusion: Kun-Chih Wang's passion for innovation, coupled with his relentless pursuit of excellence, continues to inspire the next generation of inventors and researchers, making him a true pioneer in the world of technology and patents.

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