The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2006
Filed:
Nov. 10, 2004
Bing-chang Wu, Hsin-Chu Hsien, TW;
Kun-chih Wang, Hsin-Chu, TW;
Mei-ling Chao, Hsin-Chu, TW;
Shiao-shien Chen, Hsin-Chu, TW;
Bing-Chang Wu, Hsin-Chu Hsien, TW;
Kun-Chih Wang, Hsin-Chu, TW;
Mei-Ling Chao, Hsin-Chu, TW;
Shiao-Shien Chen, Hsin-Chu, TW;
United Microelectronics Corp., Hsin-Chu, TW;
Abstract
A semiconductor chip capable of implementing wire bonding over active circuits (BOAC) is provided. The semiconductor chip includes a bonding pad structure which includes a bondable metal pad, a top interconnection metal layer, a stress-buffering dielectric, and at least a first via plug between the bondable metal pad and the top interconnection metal layer. The semiconductor chip also includes at least an interconnection metal layer, at least a second via plug between the interconnection metal layer and the bonding pad structure, and an active circuit situated underneath the bonding pad structure on a semiconductor bottom.