The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2004
Filed:
Dec. 18, 2001
Applicant:
Inventor:
Kun-Chih Wang, Hsin-Chu, TW;
Assignee:
United Microelectronics Corp., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/900 ; H01L 2/182 ;
U.S. Cl.
CPC ...
H01L 2/900 ; H01L 2/182 ;
Abstract
A structure for using fuse structure integrated wire bonding on the substrate, and relates to methods for making the same are disclosed, in which an Al-fuse has an extra-etching process pattern by fuse-open mask and has been thinned down from Al-fuse thickness. The Al fuse structure integrated Al wire-bonding pad has two kind of thickness under fuse-open and for the other area. This invention makes the fuse easy to blow without suffering any bondability from wire bonding for packaging.