The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2002

Filed:

Jul. 26, 1999
Applicant:
Inventors:

Kun-Chih Wang, Tao-Yuan, TW;

Chao-Ching Hsieh, Hsin-Chu Hsien, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 1/600 ;
U.S. Cl.
CPC ...
C23C 1/600 ;
Abstract

The present invention provides a physical vapor deposition device for forming a metallic layer with a predetermined thickness on a semiconductor wafer. The PVD device comprises a chamber, a wafer chuck installed at the bottom end of the chamber through which the semiconductor wafer is hold horizontally, a metallic ion generator for generating metallic ions, an electric field generator for forming a vertical electric field above the wafer chuck that guides the metallic ions toward the wafer chuck, and a magnetic field generator. The magnetic field generator generates a magnetic field perpendicular to the direction of movement of the metallic ions to create a horizontal moving force on the metallic ions thus causing the metallic ions to deposit on the semiconductor wafer at a slant angle.


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