Kuo-Ming Chen

Title: Kuo-Ming Chen: Innovator in Semiconductor Packaging

Introduction

Kuo-Ming Chen is a prominent inventor based in Hsin-Chu Hsien, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 9 patents. His innovative designs and processes have advanced the technology used in chip packaging, making him a notable figure in the industry.

Latest Patents

Among his latest patents is the "Fan-out wafer level package," which includes a semiconductor element, a molding compound, a first fan-out structure, a conductive heat spreader, and a plurality of solder balls. This invention enhances the efficiency of semiconductor packaging by ensuring that the semiconductor element's bonding pads are effectively connected to the fan-out contacts. Another significant patent is the "Chip packaging process," which outlines a method for connecting bond pads on a wafer's active surface to the backside through several through holes. This innovative process improves the reliability and performance of chip packaging.

Career Highlights

Kuo-Ming Chen has worked with notable companies in the semiconductor industry, including United Microelectronics Corporation and United Electronics Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Throughout his career, Kuo-Ming Chen has collaborated with esteemed colleagues such as Kai-Kuang Ho and Hung-Min Liu. These partnerships have fostered an environment of innovation and have led to the development of several key technologies in the field.

Conclusion

Kuo-Ming Chen's contributions to semiconductor packaging through his patents and collaborations have established him as a leading inventor in the industry. His work continues to influence the future of semiconductor technology and packaging processes.