The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2009
Filed:
Nov. 27, 2006
Min-chih Hsuan, Hsinchu, TW;
Kai-kuang Ho, Hsinchu, TW;
Kuo-ming Chen, Hsinchu, TW;
Kuang-hui Tang, Kaohsiung, TW;
Min-Chih Hsuan, Hsinchu, TW;
Kai-Kuang Ho, Hsinchu, TW;
Kuo-Ming Chen, Hsinchu, TW;
Kuang-Hui Tang, Kaohsiung, TW;
United Microelectronics Corp., Hsinchu, TW;
Abstract
A chip packaging process includes providing a wafer, having an active surface and a backside. The wafer has a first chip area and a second chip area adjacent to the first chip area. The wafer has several first and second bond pads on the active surface in the first and second chip areas respectively. Several through holes are formed on the wafer. The through holes pass through the wafer and connect the active surface and the backside. The through. holes are arranged between the first chip area and the second chip area. Several connecting lines are formed on peripheral surfaces of the through holes. Each of the connecting lines has a first end portion extending on the active surface and a second portion extending on the backside. Each the first end portion is electrically connected to one of the first bond pads and one of the second bond pads.