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For the Inventor, By the Inventor

Hsinchu, Taiwan

Kai-Kuang Ho

This inventor holds 24 USPTO granted patents and 25 published patent applications, primarily in Semiconductor Packaging. Top assignee: United Microelectronics Corp.. Active years: 2000-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kai-Kuang Ho. Retrieved from https://idiyas.com/inventor/kai-kuang-ho

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 100.0

Average Co-Inventor Count = 2.9

ph-index = 5

Forward Citations = 247(Granted Patents)


Location History:

  • Kaohsiung Hsien, TW (2000)
  • Feng-Shan, TW (2001 - 2002)
  • Hsin-Chu, TW (2003 - 2023)

Company Filing History:

goldMedal24 out of 7,278 
 
United Microelectronics Corp.
 patents

Years Active: 2000-2026

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Areas of Expertise:
Surface Acoustic Wave Device
Semiconductor Package
Wafer-Level Chip Scale Package
Copper Pillar Bump Structure
QFN Package
Integrated Circuit Packages
Chip Packaging Process
Wafer Dicing
Fabrication Method
Integrated Die Bumping Process
Test Structure
UBM Layer
24 patents (USPTO):Explore Patents
1. 12756375 - Surface acoustic wave device (2026-10-06),
2. 12672497 - Wafer with test structure and method of dicing wafer (2026-06-30),
3. 12628692 - Semiconductor package, semiconductor bonding structure, and method of fabricating the same (2026-05-12),
4. 12525566 - Semiconductor package and fabrication method thereof (2026-01-13),
5. 12482777 - Copper pillar bump structure and method of manufacturing the same (2025-11-25),
6. 12417985 - Semiconductor device and method for fabricating the same (2025-09-16),
7. 12387998 - QFN package and fabricating method of the same (2025-08-12),
8. 11848660 - Surface acoustic wave device fabrication method (2023-12-19),
9. 11495510 - Semiconductor device package structure and method for fabricating the same (2022-11-08),
10. 9502366 - Semiconductor structure with UBM layer and method of fabricating the same (2016-11-22),
11. 7696606 - Metal structure (2010-04-13),
12. 7649268 - Semiconductor wafer (2010-01-19),
13. 7534653 - Chip packaging process (2009-05-19),
14. 7399695 - Integrated die bumping process (2008-07-15),
15. 7387950 - Method for forming a metal structure (2008-06-17),

Title: Innovations by Kai-Kuang Ho in Semiconductor Technology

Introduction

Kai-Kuang Ho is a prominent inventor hailing from Hsin-Chu, Taiwan. He is recognized for his significant contributions to the semiconductor industry, holding a total of 24 patents. His innovative work focuses on advancing semiconductor device fabrication methods and improving packaging techniques.

Latest Patents

Among his latest patents, two noteworthy inventions include:

1. **Semiconductor Device and Method for Fabricating the Same**: This invention comprises a semiconductor device featuring a semiconductor substrate, a circuit structure on the front surface, and a ring-shaped protrusion on the rear surface. This structure allows for improved performance and functionality in semiconductor applications.

2. **QFN Package and Fabricating Method of the Same**: This patent describes a QFN (Quad Flat No-Leads) package that includes a copper lead frame with a die paddle. The design integrates a coolant passage within the die paddle to enhance thermal management, ensuring efficient operation of the semiconductor device.

Career Highlights

Kai-Kuang Ho is currently employed at United Microelectronics Corporation (UMC), where he leverages his expertise to drive innovation in semiconductor technology. His career at UMC reflects a commitment to research and development, contributing to the company's reputation as a leader in the semiconductor manufacturing industry.

Collaborations

Throughout his career, Kai-Kuang has collaborated with other professionals in the field, such as Kuo-Ming Chen and Te-Sheng Yang. These partnerships have led to the successful development of advanced technologies and patents, furthering the potential of semiconductor applications.

Conclusion

In conclusion, Kai-Kuang Ho's contributions to the semiconductor industry, exemplified by his 24 patents and recent innovations, underscore his role as a key player in enhancing technology. His work continues to inspire future advancements in semiconductor devices and packaging methods.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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