The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Nov. 14, 2022
Applicant:
United Microelectronics Corp., Hsin-Chu, TW;
Inventors:
Assignee:
UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/4821 (2013.01); H01L 23/49503 (2013.01); H01L 23/4952 (2013.01); H01L 23/49534 (2013.01); H01L 23/49548 (2013.01); H01L 23/49579 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/48011 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48249 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49052 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/182 (2013.01);
Abstract
A QFN package includes a copper lead frame. The copper lead frame includes a die paddle. A die is fixed on the die pad. A coolant passage is disposed within the die paddle. An inlet passage connects to one end of the coolant passage. An outlet passage connects to another end of the coolant passage. A mold compound encapsulates the copper lead frame and the die.