This inventor holds 1 USPTO granted patent. Top assignee: United Microelectronics Corp.. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: The Innovative Contributions of Chiu-Feng Lee
Introduction
Chiu-Feng Lee is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative designs and methods. His work has been instrumental in advancing technology in this area.
Latest Patents
Chiu-Feng Lee holds a patent for a QFN package and the fabricating method of the same. This QFN package features a copper lead frame that includes a die paddle. A die is fixed on the die pad, and a coolant passage is integrated within the die paddle. An inlet passage connects to one end of the coolant passage, while an outlet passage connects to the other end. The entire assembly is encapsulated in a mold compound, ensuring durability and efficiency.
Career Highlights
Chiu-Feng Lee is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His role involves developing advanced packaging solutions that enhance the performance and reliability of electronic devices. His expertise has contributed to the company's reputation for innovation and quality.
Collaborations
Chiu-Feng Lee has worked alongside talented colleagues, including Chen-Hsiao Wang and Kai-Kuang Ho. Their collaborative efforts have led to the successful development of various projects within the company.
Conclusion
Chiu-Feng Lee's innovative work in semiconductor packaging exemplifies the impact of dedicated inventors in advancing technology. His contributions continue to shape the future of the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile