Hsinchu, Taiwan

Chen-Hsiao Wang

USPTO Granted Patents = 6 

Average Co-Inventor Count = 2.9

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2016-2025

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6 patents (USPTO):Explore Patents

Title: Innovations of Chen-Hsiao Wang

Introduction

Chen-Hsiao Wang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging and surface acoustic wave devices. With a total of 6 patents to his name, Wang continues to push the boundaries of technology through his innovative designs.

Latest Patents

Wang's latest patents include a QFN package and a method for fabricating the same. This QFN package features a copper lead frame that includes a die paddle, where a die is fixed. A coolant passage is integrated within the die paddle, with an inlet and outlet passage connecting to either end of the coolant passage. Additionally, he has developed a surface acoustic wave (SAW) device fabrication method. This method involves a substrate with multiple surface acoustic wave elements, surrounded by a conductive structure that includes a wall part and a lateral layer part, capped with a layer that closes the opening above the elements.

Career Highlights

Wang is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work focuses on enhancing the efficiency and performance of electronic devices through innovative packaging solutions.

Collaborations

Wang collaborates with notable colleagues such as Kai-Kuang Ho and Yi-Feng Hsu, contributing to a dynamic team that drives technological advancements in their field.

Conclusion

Chen-Hsiao Wang's contributions to semiconductor technology and his innovative patents highlight his role as a key figure in the industry. His work continues to influence the development of advanced electronic devices.

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