The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2023
Filed:
Dec. 29, 2020
Applicant:
United Microelectronics Corp., Hsinchu, TW;
Inventors:
Chen-Hsiao Wang, Hsinchu, TW;
Kai-Kuang Ho, Hsinchu, TW;
Assignee:
UNITED MICROELECTRONICS CORP., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03H 3/08 (2006.01); H03H 9/25 (2006.01); H03H 9/02 (2006.01); H10N 30/02 (2023.01); H10N 30/88 (2023.01);
U.S. Cl.
CPC ...
H03H 9/1092 (2013.01); H03H 3/08 (2013.01); H03H 9/02937 (2013.01); H03H 9/25 (2013.01); H10N 30/02 (2023.02); H10N 30/883 (2023.02); Y10T 29/42 (2015.01); Y10T 29/49005 (2015.01);
Abstract
A surface acoustic wave (SAW) device including a substrate is provided. Multiple surface acoustic wave elements are disposed on the substrate. A conductive surrounding structure includes: a wall part, disposed on the substrate and surrounding the surface acoustic wave elements; and a lateral layer part, disposed on the wall part. The lateral layer part has an opening above the surface acoustic wave elements. A cap layer covers the lateral layer part and closes the opening.