The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Jan. 14, 2021
Applicant:

United Microelectronics Corp., Hsinchu, TW;

Inventors:

Meng-Ting Chiang, Taichung, TW;

Jen-Hsien Chang, Taichung, TW;

Kai-Kuang Ho, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/3065 (2006.01); H01L 21/78 (2006.01); H10D 62/10 (2025.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/3065 (2013.01); H01L 21/78 (2013.01); H10D 62/117 (2025.01);
Abstract

A semiconductor device includes a semiconductor substrate, a circuit structure and a ring-shaped protrusion. The semiconductor substrate has a front surface and a rear surface opposed to each other. The circuit structure is located on the front surface. The ring-shaped protrusion is protruded on the rear surface.


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