The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2002
Filed:
Mar. 13, 2000
Hermen Liu, Taoyuan Hsien, TW;
United Microelectronics Corp., Hsinchu, TW;
Abstract
An interlace grid array package structure and method of manufacture that utilizes a single sided molding method whose connection with an integrated circuit board is through the underside of the package's plastic body. Therefore, only the alternating contact points arranged into a grid array are exposed for connection after a surface mount operation. Hence, the leads of a lead frame are not protrudent. Therefore, the problem of bent leads is eliminated and the overall package area and thickness is reduced. Since the alternating contact point design of a grid array package increases connection pitch, short-circuiting of neighboring contact points is greatly reduced and a higher yield is obtained.