The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2001
Filed:
Oct. 07, 1999
Applicant:
Inventor:
Hermen Liu, Taoyuan Hsien, TW;
Assignee:
United Microelectronics Corp., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/302 ;
U.S. Cl.
CPC ...
H01L 2/302 ;
Abstract
A multi-chip semiconductor package is described. By changing the design for a lead frame, two or more chips are packaged together. A die pad whose surface area is smaller than that of a chip is used so that bonding pads can be exposed and chips can mounted with the same direction. Therefore, wires are not crossed during wire bonding. Thus, chips do not need additional treatment. Performance and density of the package can be enhanced without increasing capital expenditure. Device integration is also increased.